Starting date :
01/12/2022 > 31/05/2026
Lifetime :
42 months
Program in support :
DIGITAL-2021-CLOUD-AI-01 & ANR-22-PVIL
Status project :
in progress
CEA-Leti's contact :
Project Coordinator :
CEA-Leti
Partners: - CEA, Grenoble
- IMEC, Louvain, Belgique (institut de recherche)
- VTT, Espoo, Finlandaise (centre de recherche)
- 4 institut de Fraunhofer (IPMS, IZM, IIS EMFT)
Investment :
156 M€ (169.3 M$)
Targeted Markets :
The PREVAIL initiative will create substantial opportunities for business (including SME’s Start-up & scale-ups) active in the semiconductor industry as EU-level resources are brought to bear. PREVAIL TEF will support the European Chips Act to position Europe alongside equivalent initiatives globally in countries such as the U.S. and China and continued efforts at the Member State-level.
Keywords :
Artificial intelligence; Internet of Things; Embedded systems; Pervasive systems
Photo credit :
@Andréa AUBERT/CEA
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- PREVAIL project will be the first step to create the European TEF HW AI infrastructure. It will focus on the procurement, installation, and preparation of necessary equipment tools, focusing on the above-mentioned technologies, to reach a higher level of maturity (TRL 6-7). The resulting infrastructure will be capable of fabricating samples of functional chips that could be tested in the field in real edge AI applications. A critical aspect in the choice of the technologies is that the relative IP belongs to the partners and can be made available on a non-exclusive, market valued, fair and reasonable licensing base to users that would want to take the result to an industrial level.
Objectives
- The main objective of the PREVAIL project is to establish and start operating the core of a networked, multi-hub platform providing prototype chip fabrication capability, in advanced technology, to EU stakeholders for Artificial Intelligence (AI) applications. Four major European Research and Technology Organisations (RTOs) have set up this consortium to build on their advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion to create a new multi-hub Test and Experimentation Facility for edge AI Hardware (TEF HW AI). This infrastructure will enable a trusted, non-discriminatory test facility in Europe capable of validating high-performance, low-power edge components and technologies to support the digital transformation. It will focus on the procurement, installation, and preparation of necessary equipment tools, on key digital functionalities: advanced non-volatile embedded memories (MRAM, OxRAM, FeRAM), 3D heterogeneous integration and assembling (die to die, die to wafer, wafer to wafer), integrated photonics and RF components and test, already develop by the partners. These will be brought to a level of maturity (TRL 6-7) to achieve an infrastructure capable of fabricating early prototype samples that could be tested in real edge AI applications. To reach this target it is necessary to freeze parts of the process flow in a more stable and statistically monitored infrastructure, lower the number of bottlenecks and the sources of yield detraction and enlarge the testing capabilities. Within the available budget and in discussion with early adopters in industry, PREVAIL will invest selectively to complement and strengthen the available capacity and capability to surmount the most essential limiting factors for each proposed technology. After the execution of PREVAIL project, the TEF will be ideally placed to be integrated with other open offers and chip IP design activities to further extend its scope.
Impacts
- The PREVAIL project will create a multi-hub Test and Experimentation Facility (TEF) for edge AI hardware. This infrastructure will enable a trusted, non-discriminatory test facility in Europe capable of validating high-performance, low-power edge components and technologies to support digital transformation.
- Four major European Research and Technology Organizations (RTOs) have set up this consortium to build on their advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion.
- The consortium partners will bring their cutting-edge technologies to a higher maturity level and give users the possibility to fabricate and test AI prototypes based on these innovative technologies:
- Advanced non-volatile embedded memories (MRAM, OxRAM, FeRAM)
- 3D heterogeneous integration and assembling (die to die, die to wafer, die to substrate, wafer to wafer)
- Integrated photonics and RF components
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